Hechen Wang received the B.S. degree in micro-electronics and solid-electronics from the University of Electrical Science and Technology of China (UESTC), Chengdu, China, in 2012, the M.S. and Ph.D. degrees in electrical and computer engineering from Auburn University, Auburn, AL, USA, in 2013 and 2018, with a focus on the design of integrated digital frequency synthesizer circuits and time-to-digital converters. He has authored or co-authored more than 50 IEEE conference, journal papers, issued U.S. patents and one book chapter. Dr. Wang was a recipient of the IEEE Radio Frequency Integrated Circuits Symposium (RFIC) Best Student Paper Award in 2016, and the IEEE Custom Integrated Circuits Conference (CICC) Best Regular Paper Award in 2017. 

ARTICLE

JOURNALS

BOOK CHAPTERS

CONFERENCES

Energy efficient BNN accelerator using CiM and a time-interleaved Hadamard digital GRNG in 22nm CMOS (2022)

PEER REVIEW

IEEE International Solid-State Circuits Conference (ISSCC) 2023-

IEEE International Electron Devices Meeting (IEDM) 2022-

IEEE International Symposium on VLSI Technology and Circuits (VLSI) 2022-

IEEE International Symposium on Circuits and Systems (ISCAS) 2022-

IEEE International Conference on Artificial Intelligence Circuits and Systems (AICAS) 2021-

IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) 2020-

IEEE International Symposium on VLSI Design, Automation and Test (VLSI-DAT) 2014-

TECHNICAL PROGRAM COMMITTEE & EDITOR & CHAIR

Conference Organizing Committee, Workshops/Tutorials Chair

Circuit Design, 3D Integration and Advanced Packaging (ICAP)

AWARDS

IEEE Custom Integrated Circuits Conference (CICC) Best Regular Paper Award 2018

Intel Design and Test Technology Conference (DTTC) Best Paper Presentation Award 2022

Semiconductor Research Corporation (SRC) Mahboob Khan Outstanding Liaison Award 2022